Design for Thermal Issues - Associate Study Module [Level HE7] part-time

Modern circuits operate at ever-higher frequencies and dissipate an increasing amount of heat, whilst end-user pressures demand smaller enclosures. Consequently, most design and electronic packaging engineers now need to take thermal issues into account to ensure that their products will meet the required performance and reliability specifications. This module places emphasis on understanding the fundamental issues of heat transfer that lie behind recommended good practice, and on modelling the thermal aspects of a design as a means of ensuring reliable operation at affordable cost. It explores the issues progressively, first at component level, then at board level and finally at system level, concentrating on the application of analysis methods and simulation tools and on generating practical solutions.

The course will benefit electronic system and circuit designers, layout designers, production engineers, mechanical engineers, quality engineers, and managers of professionals in all these disciplines, who need a broad picture of the thermal aspects of electronic layout and equipment practice, whether as current practitioners or newcomers to this field.

The module can be studied on its own or as part of a programme leading to a formal qualification.