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Description
This module considers the technical aspects of applying signal integrity requirements and constraints during the design phase of a product‚s development. It covers high speed digital signals and power supply planes and focuses on the design of PCB interconnects. Simulation techniques are employed extensively through the use of SigXplorer and Power Integrity tools from the Cadence PCB Design Suite. The module builds on the topics introduced in module AMI4814 Signal Integrity and EMC.
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This module considers the technical aspects of applying signal
integrity requirements and constraints during the design phase of a
product‚s development. It covers high speed digital signals and
power supply planes and focuses on the design of PCB interconnects.
Simulation techniques are employed extensively through the use of
SigXplorer and Power Integrity tools from the Cadence PCB Design
Suite. The module builds on the topics introduced in module AMI4814
Signal Integrity and EMC.
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